First we remove the SIM / SD tray to be able to later remove the back cover.

We will disengage the back shell by prying it with an opening tool. Once opened, we will have to disconnect the fingerprint reader.

We remove the screws that hold the inner casing and the speaker module and disengage it.

Now undo the case of the motherboard.

We disconnect the battery from the motherboard and then remove the adhesive strips that attach it to the chassis.

We disconnect the components of the motherboard to be able to disengage it.

We take off the flexes of the screen of the chassis and heat it to soften the adhesive.

We will heat the screen at about 60 ° C for about one minute.

With the hot screen, we introduce an opening tool between it and the frame to separate it. Before separating it, we will slide the flex cables through the holes in the chassis.