We will start by removing the back cover. For this we will use an opening tool, which we will move along the contour of the phone to release the notches that hold it.

To remove this case, we first remove the thirteen Phillips screws (PH # 00) that attach it to the chassis. Once the screws are removed, we will use a flat tool to release it.

In this step, we will disconnect the components connected to the motherboard to be able to remove it later.

We disconnected the battery, the flex of side buttons, the flex connection with the auxiliary plate and the flex of the display.

The last thing we have left to disconnect now, is the flex of the digitizer.

In order to remove the motherboard, we will remove the Phillips screw (PH # 00) that holds it.

Now we can undo the base plate of the chassis. We will disconnect the coaxial cable to be able to move it away.

We will also take advantage to take off and remove the battery.

Before proceeding to heat the screen, we will take advantage to take off the display flex.

Now we will heat the screen to soften the adhesive and thus it will be easier for us to take it off later.

In this case we will use the thermal pad (hotglass) which we will introduce in the microwave to heat it (following the instructions for use).

With the hot screen, we will introduce a spike between the screen and the frame. We will start after the bottom part and continue after the sides.

We will avoid slipping the spike at the top since that is where the digitizer flex is located.

Finally, we will slide the flex through the hole in the chassis and we can remove the screen.