Before starting make sure that the mobile is off.

Remove the SIM card and micro SD.

The back cover is attached to the back with adhesive. It will be necessary to apply a little heat to soften the glue.

Use the hot air gun to heat the back cover slightly and take it off easily.

The gun emits very hot air, use with caution. We recommend the minimum power and short bursts.

As an alternative to the hot air gun, we suggest the use of HOT GLASS, a heat blanket, with high thermal retention.

Insert the HOT GLASS in the microwave for the time specified in the instructions.

To heat it evenly, it is necessary to interrupt the microwave every 30 seconds to distribute heat throughout the HOT GLASS with your hands.

Apply heat directly to the back cover for a couple of minutes.

Hold the back cover with the suction cup while lifting it off with the spike.

Remove the back cover.

Disconnect the battery from the motherboard and remove it by pulling the white ribbon on the bottom.

Remove the 2 Torx screws that hold the base plate.

Remove the protective adhesive and disconnect the flex from the light sensor, by pulling on the tab of the connector and gently pulling on the cable.

Disconnect the data flexes (bottom plate, sim reader, ...) as well as the antenna coaxial cable.

Remove the adhesive covering the flex from the screen.

Part of the flex is glued to the metal shield of the plate, remove it carefully while disconnecting the connector.

Disassemble the plate by pushing it down slightly and lifting the top.

The plate will continue linked by the flex cable of the display.

Unplug and separate the motherboard.

Disassemble the DIV antenna module and handset.

Finally, take off the handset of the DIV antenna module.