Before starting make sure that the equipment is turned off.

Remove the SIM card.

Remove the microSD card.

Separate the housing (back cover + intermediate frame) with the tine, just enough to pry with the wide part of the double opening tool.

Disconnect the digitizer flex from the motherboard.

Warm the edges of the screen with the heating air gun, to soften the glue and to peel off easily.

The gun emits VERY hot air, use with caution.

We recommend the use at minimum power and short bursts, since excess heat can damage the equipment.

As an alternative to the air gun, I suggest the use of HOT GLASS, a high thermal retention blanket.

Insert the HOT GLASS in the microwave for the time specified in the instructions.

To heat it evenly, it is necessary to interrupt the microwave every 30 seconds to distribute heat throughout the HOT GLASS with your hands.

Apply heat to the edges of the screen for a couple of minutes.

Insert the tip of the tine behind the scanner glass and trace the contour of the equipment, avoiding the top side, so as not to damage the flex.

Put thicker tines as a wedge so that it does not stick again.

Peel off the remaining side, taking care not to damage the flex cable.

Disconnect the flex from the audio output of the motherboard.

Unplug the flex from the side buttons.

Disconnect the front camera with proximity sensor.

Separate the base plate, fastened by 5 Phillips screws.

Gently press the back of the display with your fingers to separate it from the case.