We start by heating the back cover to soften the adhesive. We will heat it to 60ºC for about a minute. With the hot lid, we will slide a flat opening tool all the way around to remove the adhesive.

Remove the eleven Phillips screws (PH # 00) that hold the inner casing and unhook it.

Disconnect the components of the motherboard, remove the SIM / SD tray and disengage the base plate of the chassis.

Remove the Phillips screw (PH # 00) that holds the connector bracket and remove it. Now we can detach the speaker module connector.

Now we remove the screw that holds the speaker module and we unlock it to be able to disengage the audio connector also.