To open the case we will first remove the sd card holder and then remove the 2 screws from the bottom.

Use the prong to open the housing by moving it around the contour of the phone with care.

Now we will remove the screws of the housing and the lower module.

We will lever with an opening tool to remove the inner shell.

Now we will proceed to disconnect all the elements of the plate to be able to remove it.

We will disconnect the remaining elements to be able to remove the plate and avoid damaging it when removing the screen.

In the next step we will need to heat the glass to soften the glue and thus be able to remove the screen more easily.

Below we will see two ways to perform this step.

We will use a high thermal retention blanket (HOT GLASS) to heat the glass.

Insert the HOT GLASS in the microwave for the time specified in the instructions.

To heat it evenly, it is necessary to interrupt the microwave every 30 seconds to distribute heat throughout the HOT GLASS with your hands.

The gun emits VERY hot air, use with caution.

We recommend the use at minimum power and short bursts, since excess heat can damage the equipment.

Warm the screen to soften the glue and be able to easily peel it off.

With the hot screen we will take it off by helping us with the spike. Avoid the upper part so as not to damage the flex of the screen.

Once detached, we will slide the flex cables through the holes in the chassis with care as they can break.