Characteristics:

To open the back cover, we will use a plastic opening tool and we will pry it loose.

We take out the battery, the SIM card and the SD card.

Remove the nine Phillips screws (PH # 00) that hold the housing.

Using a plastic opening tool we will separate the chassis housing.

We disconnect the components connected to the motherboard to be able to remove it.

In this step we will need to heat the glass to soften the glue and thus be able to remove the screen more easily.

Below we will see two ways to perform this step.

We will use a high thermal retention blanket (HOT GLASS) to heat the glass.

Insert the HOT GLASS in the microwave for the time specified in the instructions.

To heat it evenly, it is necessary to interrupt the microwave every 30 seconds to distribute the heat through the hands of the HOT GLASS.

The gun emits VERY hot air, use with caution.

We recommend the use at minimum power and short bursts, since excess heat can damage the equipment.

Warm the screen to soften the glue and be able to easily peel it off.

When the screen is hot enough, we will introduce a spike between the window and the frame to unstick it. We will take special care not to break the flex of the digitizer or the LCD display.

Once detached we should not separate it yet.

With the screen detached, we will slide the flex cables through the holes in the chassis.

We remove the remains of glue and, using a tine, take off the touch screen.