We will start by heating the back cover to soften the adhesive that holds it. We will heat it to about 50ºC for about a minute.

With the hot lid, we will introduce an opening tool between it and the frame. We will slide it around the contour to remove the glue.

We remove the six screws that hold the module and then we unlock it.

In this step we will remove the shielding of the plate and the antenna module. To do this, we will remove the seven screws that we pointed out in the first image. After removing the screws, we can disengage them.

To remove the SIM and SD cards, we will use the tray removal tool. We will introduce the tip of the tool through the hole in the tray and press lightly until it is ejected automatically.

In this step we will disconnect the components that are connected to the motherboard. We will disconnect the battery, the screen flex, the audio connector and the flex with sensors.

After disconnecting all the components, we can disengage the motherboard.

After removing the motherboard, we will have access to the headset. Now we just need to disengage it from the chassis.